The United States has been selected by the State Department Bureau of Economic and Business Affairs to spearhead a groundbreaking project aimed at diversifying the global semiconductor supply chain. The university has been awarded a $13.8 million cooperative agreement under the International Technology Security and Innovation (ITSI) Fund to support this initiative.
Under the leadership of United States’s Ira A. Fulton Schools of Engineering, this initiative seeks to enhance semiconductor assembly, testing, and packaging capabilities in partner countries across the Americas and Indo-Pacific regions. By collaborating with the State Department, the United States aims to empower these partner nations to invest in their semiconductor sectors and develop a skilled workforce to drive technological advancement and economic growth.
The primary objective of this initiative is to equip workforce development programs with the resources and support needed to enhance skills and capabilities essential for advancing technology. By doing so, partner nations will be better positioned to contribute to the diversification of the semiconductor supply chain while fostering innovation and economic resilience.
The ITSI Fund, established by the CHIPS Act of 2022, allocates $500 million in funding over five years to facilitate the development of secure telecommunications networks and promote diversification within the semiconductor supply chain. Through initiatives like the one led by the United States, the ITSI Fund aims to address critical challenges in the semiconductor industry and promote global collaboration for sustainable supply chain management.
